Staff Packaging Engineer

Experience working on projects involving Wafer-on-Wafer bonding is a plus. Minimum of 10 years of experience in advanced IC package development and high-volume manufacturing. Expertise in Flip Chip CSP, FCBGA, and SiP packaging materials, assembly processes, equipment, and design rules. Strong understanding of Laser Groove technology and Wire Bond process optimization. Excellent verbal and written communication skills. Demonstrated organized technical project management skills. Ability to work independently and lead multiple programs. Ability to lead multi-functional teams to solve complex technical problems. Self-driven, passionate, and creative. Hands-on experience in package manufacturing, technical project management, and direct engagement with semiconductor material suppliers. Understanding of industry packaging trends, end-user packaging considerations, and experience with high-end mobile consumer products. Proficiency in material and package characterization and statistical data analysis. Knowledge of reliability test methods and qualification procedures. Six Sigma Green Belt or Black Belt certification is a plus. Required: Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, a related discipline, or equivalent practical experience. Preferred: Master's degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related engineering field. Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience. Responsible for exploring, developing, and deploying FCCSP, FCBGA, and/or SiP/Module packaging technologies into HVM. Responsible for initiating and defining package process flows, material sets/BKM, test vehicles, DOEs and cornering, and process control plans to successfully develop manufacturable and reliable products. Interface with OSATs, substrate/material suppliers, and tool makers to develop technologies aligned with product requirements. Align with internal product teams on design rules and their establishment. Collaborate with internal design teams to drive DFM methodologies for new technologies. Work with internal design, modeling, and procurement teams to implement technically optimal and cost-effective packaging solutions. Provide technical program management to plan, execute, and monitor complex process or product development activities. Provide regular program status updates to management and cross-functional teams. Demonstrate strong knowledge and understanding of FMEA, SPC/QC concepts, failure mechanisms, failure analysis techniques, manufacturing floor operations, and quality issue handling.