Staff IC Packaging Substrate Engineer (Korea)
- Responsible for QNM and 2D Chiplet product introduction (NPI) - Responsible for alternate substrate (RDL like, optical, organic bridge) - Responsible for advanced structure design rule set-up, new material exploration and new supplier enablement. - Work with internal design team and drive DFM methodology for new technologies. - Technical program management to plan, execute and monitor complex process or product developments. - Master's in Material Science/Chemical/Mechanical/Electrical Engineering. - 10+ years of Package Engineering or related work experience,and hands-on experience working in IC substrate manufacturing factory (FCBGA/FCCSP) - Hands on experience working in substrate material factory or semiconductor packaging environment. - Experience with development, high-volume manufacturing, troubling shooting of IC substrate (FCBGA/FCCSP) - Understanding of organic laminate manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component & board level reliability testing. - Experience of Technical program management to plan, execute, and monitor complex process or product developments. - Knowledge in DOE, control plan, FMEA and other statistical process control method. - Proficiency in material and characterization data analysis, and statistical data analysis. - Knowledge of reliability test methods and qualification procedure. - Good oral and written communication skills, strong team player & project management skills. Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.
