Lead Application Engineer
About this Position Join the global leading Printed Electronics team in APAC region, based in Shanghai, focusing on the development and application of functional conductive inks (Silver pastes, Carbon pastes, and Dielectric inks). This role serves as the critical technical bridge between R D and mass production, ensuring our advanced materials are perfectly translated into high-performance functional circuits (Antennas, Sensors, Touch panels, etc.). You will work in a fast-paced environment that combines lab-scale innovation with real-world factory floor troubleshooting, providing a unique opportunity to influence both product design and customer manufacturing success. What you´ll do External Technical Support (50%): Lead the optimization of printing processes at customer OEM/EMS sites (e.g., Foxconn, Lux share). You will be responsible for "dialing in" equipment parameters to ensure our conductive inks perform at their peak, preventing sub-optimal results caused by non-specialized onsite operators. Internal R D Collaboration (30%): Partner with R D scientists to validate new formulations. You will simulate customer production environments in the lab using industrial-grade Screen Printing and Pad Printing equipment to refine product "printability" and reliability. Process Engineering: Own the end-to-end printing workflow, including screen mesh selection (tension/emulsion), squeegee pressure optimization, snap-off distance, and drying/curing profiles to maximize electrical conductivity and fine-line resolution. Application Advisory: Provide expert feedback to R D from a "manufacturing-ready" perspective, ensuring new silver/carbon pastes are compatible with high-speed, high-volume production requirements.
