Process Development Engineer (R&D)

Summary

We live in a mobile and device driven world where knowledge of the physical world around us is needed. We rely on this knowledge to get around, to learn about our environment and to enable spectacular new features for custom applications. Apple is meeting those needs as robustly and as creatively as possible and is interested in people who want to help meet that commitment. The success we are striving will be the result of very skilled people working in an environment which cultivates creativity, partnership, and thinking of old problems in new ways. If that sounds like the kind of environment that you find intriguing, then let's talk. These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a team that sets the standard in cultivating excellence, creativity and innovation. Excellent opportunity to join our Process Development team. You will conduct feasibility studies, develop new process and material development for new module technologies under research and development. Will you help us design the next generation of revolutionary Apple products?

Description

The successful candidate will have the opportunity to develop processes for next generation products in Apple’s ecosystem. Responsible to establish new baseline processes by conducting proof of concept (POC) studies and Design of Experiments (DOEs). Also be responsible to define Critical-To-Quality (CTQ) metrics, their specifications and the necessary metrology tools/procedures required to measure these CTQs. Have the opportunity to develop new process equipments with the support from external vendors, and showcase analytical skills by preparing and presenting engineering reports to cross-functional teams.

Minimum Qualifications

Degree of Science in Engineering or equivalent Minimum 2 to 3 years of experience in doing process R&D Clear and effective written and communication skills Hands-on experience in various module assembly processes such as flip chip, flex attach, pick and place, glue dispensing, wire bonding, filling, laser soldering, component cleaning, curing, plating, singulation, wafer bonding

Preferred Qualifications

Good knowledge and hands-on experience in camera or laser projector module assembly processes with high placement accuracy requirements, such as lens and VCSEL attach Good knowledge in design of experiment (DOE), engineering statistic, root cause analysis and problem solving Familiarity on different metrology tools and quantitative measurement methodology Knowledge of statistical analysis software (e.g. JMP or Minitab) Resourceful and innovative Knowledge and work experience in one or more of the following processes & handling such processes equipment - 1) Flip Chip bonding (Thermosonic, Thermocompression and etc) OR 2) EVO die bonder or any Pick & Place equipment platform OR 3) Wirebond/Studbump) OR 4) Flex Attach (Flexible Printed Circuit Board Bonding), OR 5) Glue / Solder Paste Dispensing, OR 6) Solder Jetting/Laser Wire Soldering OR 7) SMT (e.g. solder printing, component pick&place, AOI, SPI and reflow) Knowledge on adhesive or epoxy or other bonding material Experience in optical components, active alignment and high accuracy bonding process