Principal Engineer, ASIC Development Engineering (Mixed Signal IP Layout)

We are looking for technically sound and highly skilled Analog/High Speed DDR IO Layout designer with 8-12 years of experience. The ideal candidate should have a strong background in analog/IO design principles, hands-on experience with layout tools, and a passion for solving challenging technical problems.

Key Responsibilities:

• Develop and optimize MSIP IC layouts in TSMC 3nm, ensuring high performance and manufacturability.
• Collaborate with design engineers to understand design requirements and translate them into precise layouts.
• Strong experience in debugging DRC, ERC, LVS, EMIR and PERC issues independently.
• Work closely with the physical design team to integrate custom blocks into the overall chip design.
• Identify and resolve layout-related issues, providing creative solutions to meet design specifications.
• Conduct design reviews and provide technical feedback to improve layout practices and methodologies.
• Stay up-to-date with industry trends, tools, and technologies to continuously enhance layout processes
• Any prior AI knowledge/experience which can improve Layout development effort and QoR is a big plus

Qualifications

• 8-12 years of experience in Analog/High Speed DDR IO IC layout design.
• Proficiency in layout tools such as Cadence, Synopsys, or Mentor Graphics.
• Hands-on experience with custom layout design for Analog and IO circuits is required, including expertise in Bandgap references, LDOs, Clocking circuits, GPIOs, High speed DDR IOs.
• Familiarity with custom digital layout (i.e. high speed logic paths).
• Knowledge of signal integrity issues (i.e. clock/data routes, differential routing, shielding).
• Strong understanding of analog/IO design principles, including circuit performance and parasitic effects.
• Aware of layout techniques to mitigate ESD, latch-up issues.
• Holds advanced knowledge of CMOS and FinFET technologies and their impact on design and performance issues in deep sub-micron process nodes, specifically 5nm and below.
• Experience with layout concepts that incorporate reliability considerations, including techniques for managing electromigration (EM), IR drop, and self-heating.
• Experience with layout optimization for power, performance, and area (PPA) metrics.
• Excellent problem-solving skills and attention to detail.
• Effective communication and teamwork abilities.

Preferred Skills:

• Knowledge of scripting languages (e.g., Skill,TCL and SVRF) for automation tasks.

Bachelor’s or Master’s degree in Electronics or Electrical Engineering

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

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