Packaging Architect Design Engineer

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Job Description:

Hiring a talent in advanced packaging design with intensive hands-on experience in GDSII-based physical layout and in-depth knowledge in advanced 2.5D/3D packaging architect and technology. Skills in .mcm-based layout is a plus.

The job scope includes:

(1) Architect advanced packaging solution to meet future product requirements

(2) Define design rules for the new technology

(3) Design (with physical layout) test vehicles to support technology development

(4) Generation of design collaterals for new technology introduction

(5) Drive design-for-yield and design-for-cost activities after a new technology is in production

Education/Experience

Bachelor's degree in Engineering and 5+ years of related experience or Masters degree in Engineering and 3+ years of related experience

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $91,000 - $146,000 

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

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