IC Packaging Process Engineer

Summary

Do you thrive with collaboration and innovation? In the ATG-Packaging group at Apple, we are seeking a process engineer to participate in the development of exciting, new products! You will engage to provide module assembly solutions and working with cross-functional teams and equipment suppliers to develop and deploy new modules to mass production. Your efforts will be groundbreaking, often literally. We are looking for individuals who are creative in solving sophisticated problems with experience in high-volume manufacturing.

Description

• Work as the key module process engineer supporting sophisticated, high-volume modules • Work with factory partners to develop MP intent equipment, process, and materials • Lead the transition from process development to production ramp, high volume manufacturing • Work closely with internal cross functional teams – Engineering program manager, Product Design, Test, Electrical Engineering, and Operations

Minimum Qualifications

• BS ME/Physics/Material Science and 5+ years of relevant industry experience • Proven fundamentals in the high-precision mechanics, materials, and automated equipment • Hands on experience in process and materials development, automation, and data analysis/interpretation • Proven track record to transitioning products from conceptual stage to high volume production • Strong problem solving skills • Excellent interpersonal skills with good spoken and written English • Ability to travel to subcontractors frequently

Preferred Qualifications

• Ph.D. in ME/Physics/Material Science and 3+ years of relevant industry experience • Experience with Laser systems and laser material joining and molding, large panel lamination, MEMS packaging, and process integration • Fundamental knowledge of vibrations, acoustics, IC packaging and product reliability • Comfortable with using AI to automate tasks and to assist in technical development