Die Preparation Process Development Engineering

• Die Preparation (DP) process evaluation for ASIC wafer, flip chip wafer and 3D NAND wafer assembly.
• New DP process recipe development to achieve high quality product and cost down.
• New DP technology evaluation and introduction.
• Co-work with material/machine team with new package related material machine evaluation.
• Co-work with objective owner to handle new product DP process.

REQUIRED:

• Master degree in microelectronic science and technology or in material science and technology. 
• English communication skills: CET-6, be fluent both in oral and written English.
• Basic understanding of assembly process flow & materials property.
• Basic Computer & Microsoft Office skills are required, AutoCAD/Cadence/JMP are preferred.
• Be capable of analyzing SEM/FIB/TEM/EDX results, operating is preferred.
• Good communication/team work/planning skills.
• Be capable of occasionally over time work and oversea business travel.
• Prefer to have 1-2 years related working experiences.

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.