3DIC Yield Engineer, Sr. Staff

We are seeking a highly skilled Diagnostics Analytics Engineer to advance data-driven yield learning for advanced 2.5D and 3DIC products. The role involves interpreting a wide range of diagnostic data, including memory bitmaps, scan diagnosis results, TSV and interposer test outputs, and packaging-related failure signatures, to identify patterns and pinpoint likely root causes. A key responsibility is integrating heterogeneous 3DIC test data across wafer, module, and stacked configurations to build clear, actionable insights that guide yield improvement. Experience applying AI-assisted analysis and solutions is a plus. Bachelor's degree in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience. OR Master's degree in Science, Engineering, or related field and 5+ years of ASIC design, verification, validation, integration, or related work experience. OR PhD in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience. Master's or Ph.D. in Electrical Engineering, Computer Engineering, Data Science, or related field. Extensive experience in yield analysis, including advanced 2.5D, 3DIC, and DRAM products. Strong understanding of semiconductor test results analysis, silicon debug, or memory diagnostics, and scan diagnostics. Proficiency in Python or equivalent languages for data analysis and automation. Ability to interpret complex test datasets and extract meaningful diagnostic signals. Strong English communication skills with ability to present technical conclusions clearly. Experience with memory bitmap analysis, memory fail-mode classification, and BIST/BIRA repair data interpretation. Familiarity with layout correlation workflows and root-cause narrowing using design/process metadata. Understanding of TSV/interposer failure signatures and 3DIC test flows. Ability to apply statistical techniques or light ML methods for clustering or anomaly detection. Diagnostics Data Analysis Analyze large-scale fail data from wafer sort, final test, and module/stack testing to identify systematic and parametric failure trends. Interpret memory bitmap diagnostic data across SRAM, embedded DRAM, and stacked DRAM; classify fail modes and correlate with known defect signatures. Evaluate TSV/interposer failures, continuity test results, and 3D stack test patterns to detect systematic issues across layers. Analyze scan and ATPG diagnosis output, perform clustering of suspected root causes, and support defect mechanism narrowing. Build structured workflows for correlating memory repair data, redundancy usage patterns, and defect densities across multiple lots or product families. Provide clear summaries that accelerate root-cause identification for silicon, assembly, and test teams. Workflow, Tooling, and Automation Develop and maintain scripts, dashboards, or utilities to automate analysis of diagnostic results. Work closely with internal software teams to improve data pipelines for memory bitmaps, scan diagnosis, and 3DIC test logs. Ensure analysis workflows scale across product ramps and large data volumes. Partner with test engineering, DFT, process technology, packaging, and FA teams to interpret diagnostic data and validate hypotheses. Deliver clear visualizations and reports to guide decision-making for yield improvement. Participate in cross-functional deep dives on systematic failure mechanisms and propose data-supported next steps.