2026暑期实习-现场技术应用工程师实习生(模拟方向)/Analog FAE Intern

Shanghai, Shanghai, China March 2, 2026 Oracle Hcm

This is a summer Internship program for graduates from Nov, 2026 to Oct. 2027. Interview progress will start from the week of 23rd, Mar.
欢迎2026年11月至2027年10月毕业的同学加入TI暑期实习项目。面试将于3月23日正式开启。

Change the world. Love your job.
Do you strive to understand how electronics work, and enjoy debugging, coding and/or solving technical problems? If so, a Field Applications Engineer internship may be the role for you. This internship is designed to establish you as a broad technical TI expert with customer engineers and internal teams, and to teach you how functional product characteristics correlate to system-level requirements. Demonstrate your technical competency on product selection, systems, implementation and debug, as you prepare for a career as a Field Applications Engineer. 

Field Applications Engineer (FAE) Intern responsibilities include:

  • Using various sales tools and relationships with design engineering to identify all potential projects
  • Providing customers with proactive proposals for complete, system-level solutions that maximize TI content
  • Using broad technical expertise to influence customers' part selection process while favorably positioning TI versus competition

Texas Instruments will not sponsor job applicants for visas or work authorization for this position.

 

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How to Get Hired at Texas Instruments

  • Apply quickly when a matching role appears on careers.ti.com — TI runs fewer concurrent openings than many tech peers, and requisitions may close fast once qualified candidate pools are built
  • Embed exact keywords from TI job descriptions into your resume, especially semiconductor-specific terms like 'analog design,' 'embedded processing,' 'AEC-Q100,' or 'wafer test,' to optimize for Oracle HCM's keyword search functionality
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