Key Takeaways

  • 75% of U.S. employers use automated applicant tracking systems to screen resumes before a human reviews them (Harvard Business School & Accenture, 2021)
  • The most common ATS failures are missing keywords, incompatible formatting, and incorrect file types
  • ResumeGeni scores your resume across 8 parsing layers — modeled on the same steps enterprise ATS platforms like Workday, Greenhouse, and Taleo use to evaluate candidates

How ATS Resume Scoring Works

Applicant tracking systems parse your resume into structured data — extracting your name, contact info, work history, skills, and education — then score how well that data matches the job requirements. Many ATS rejections happen because the parser couldn't extract critical fields, not because the candidate wasn't qualified.

LayerWhat It ChecksWhy It Matters
Document extractionFile format, encoding, readabilityCorrupted or image-only PDFs fail immediately
Layout analysisTables, columns, headers, footersMulti-column layouts break field extraction
Section detectionExperience, education, skills headingsNon-standard headings cause sections to be missed
Field mappingName, email, phone, dates, titlesMissing contact info is a common cause of immediate rejection
Keyword matchingJob-specific terms, skills, certificationsKeyword overlap affects recruiter search visibility and ATS scoring
Chronology checkDate ordering, gap detectionReverse-chronological order is expected by most ATS
QuantificationMetrics, numbers, measurable outcomesQuantified achievements help human reviewers and some scoring models
Confidence scoringOverall parse quality and completenessLow-confidence parses get deprioritized in results

Frequently Asked Questions

Is ResumeGeni free?
Yes. ResumeGeni is currently in beta — ATS analysis, scoring, and initial improvement suggestions are free with no signup required. Full guidance and saved reports may require a free account.
What file formats are supported?
PDF, DOCX, DOC, TXT, RTF, ODT, and Apple Pages. PDF and DOCX are recommended for best ATS compatibility.
How is the ATS score calculated?
Your resume is processed through an 8-layer parsing pipeline that extracts structured data the same way enterprise ATS platforms do. The score reflects how completely and accurately your resume can be parsed, plus how well your content matches common ATS ranking criteria.
Can ATS read PDF resumes?
Yes, but not all PDFs are equal. Text-based PDFs parse well. Image-only PDFs (scanned documents) and PDFs with complex tables or multi-column layouts often fail ATS parsing. Our analyzer will flag these issues.
How do I improve my ATS score?
Focus on three areas: use a clean single-column format, include keywords from the job description naturally in your experience bullets, and ensure all sections (contact, experience, education, skills) use standard headings.

ATS Guides & Resources

Built by engineers with 12 years of experience building enterprise hiring technology at ZipRecruiter. Last updated .

Staff Packaging Engineer

Qualcomm · Seoul, Korea, Republic of

Experience working on projects involving Wafer-on-Wafer bonding is a plus. Minimum of 10 years of experience in advanced IC package development and high-volume manufacturing. Expertise in Flip Chip CSP, FCBGA, and SiP packaging materials, assembly processes, equipment, and design rules. Strong understanding of Laser Groove technology and Wire Bond process optimization. Excellent verbal and written communication skills. Demonstrated organized technical project management skills. Ability to work independently and lead multiple programs. Ability to lead multi-functional teams to solve complex technical problems. Self-driven, passionate, and creative. Hands-on experience in package manufacturing, technical project management, and direct engagement with semiconductor material suppliers. Understanding of industry packaging trends, end-user packaging considerations, and experience with high-end mobile consumer products. Proficiency in material and package characterization and statistical data analysis. Knowledge of reliability test methods and qualification procedures. Six Sigma Green Belt or Black Belt certification is a plus. Required: Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, a related discipline, or equivalent practical experience. Preferred: Master's degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related engineering field. Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience. Responsible for exploring, developing, and deploying FCCSP, FCBGA, and/or SiP/Module packaging technologies into HVM. Responsible for initiating and defining package process flows, material sets/BKM, test vehicles, DOEs and cornering, and process control plans to successfully develop manufacturable and reliable products. Interface with OSATs, substrate/material suppliers, and tool makers to develop technologies aligned with product requirements. Align with internal product teams on design rules and their establishment. Collaborate with internal design teams to drive DFM methodologies for new technologies. Work with internal design, modeling, and procurement teams to implement technically optimal and cost-effective packaging solutions. Provide technical program management to plan, execute, and monitor complex process or product development activities. Provide regular program status updates to management and cross-functional teams. Demonstrate strong knowledge and understanding of FMEA, SPC/QC concepts, failure mechanisms, failure analysis techniques, manufacturing floor operations, and quality issue handling.